photocoupler KB357NT spec no: dsad2841 rev no: v.7 date: apr/06/2005 page: 1 of 7 approved: j. lu checked: tracy deng drawn: y.w.wang erp:120500 0034 features 1.opaque type,mini - flat package. 2.subminiature type(the volume is smaller than that of our conventional dip type by as far as 30%). 3.isolation voltage between input and output viso:3750vrms. 4.employs double transfer mold technology. 5.recognized by ul and cul, file no.e225308. 6.package: 1000pcs / reel. 7.rohs compliant. applications 1.hybrid substrates that require high density mounting. 2.programmable controllers. unit : mm[inch] tolerance : 0.5[ 0 .02] unless otherwise noted. * ** * package dimensions (unit:mm) smd type
photocoupler KB357NT spec no: dsad2841 rev no: v.7 date: apr/06/2005 page: 2 of 7 approved: j. lu checked: tracy deng drawn: y.w.wang erp:120500 0034 * ** * absolute maximum ratings (ta=25 c cc c) )) ) * ** * electro - optical characteristics parameter symbol conditions min. typ. max. unit input forward voltage v f i f =20ma - 1.2 1.4 v peak forward voltage v fm i fm =0.5a - - 3.0 v reverse current i r v r =4v - - 10 ua output collector dark current i ceo vce=20v i f =0 - - 10 -7 a transfer charact - eristics current transfer ratio ctr i f = 5 ma vce=5v 50 - 600 collector - emitter saturation voltage vce (sat) i f =20ma i c =1ma - - 0.2 v response time rise time tr vce=2v i c =2ma rl=100 - 4 18 us fall time tr 3 18 us parameter symbol rating unit input forward current i f 50 ma power dissipation p 70 mw output collector - emitter voltage v ceo 35 v emitter - collector voltage v eco 6 v collector current ic 50 ma collector power dissipation p c 150 mw total power dissipation p tot 170 mw *1 isolation voltage v iso 3750 vrms operating temperature t opr - 30 to +100 c storage temperature t stg - 40 to +125 c *2 soldering temperature t sol 260 c reverse voltage v r 6 v *1 40 to 60 rh, ac for1 minute. *2 for 10 seconds. model no. rank mark ctr(%) kb357nlt l 50 to 100 kb357n1t a 80 to 160 kb357n2t b 130 to 260 kb357n3t c 200 to 400 kb357n4t d 300 to 600 kb357n5t a or b 80 to 260 kb357n6t b or c 130 to 400 kb357n7t c or d 200 to 600 kb357n8t a,b or c 80 to 400 kb357n9t b,c or d 130 to 600 kb357n0t a,b,c or d 80 to 600 KB357NT l,a,b,c,d or no mark 50 to 600
photocoupler KB357NT spec no: dsad2841 rev no: v.7 date: apr/06/2005 page: 3 of 7 approved: j. lu checked: tracy deng drawn: y.w.wang erp:120500 0034 fig. 5 collector - emitter saturation voltage vs. ambient temperature fig. 6 response time vs. load resistance fig. 3 collector current vs. collector - emitter voltage fig. 4 relative current transfer ratio vs. ambient temperature fig. 1 current transfer ratio vs. forward current fig. 2 forward current vs. forward voltage
photocoupler KB357NT spec no: dsad2841 rev no: v.7 date: apr/06/2005 page: 4 of 7 approved: j. lu checked: tracy deng drawn: y.w.wang erp:120500 0034 fig. 7 collector - emitter saturation voltage vs. forward current fig. 8 collector dark current vs. ambient temperature test circuit for response time
photocoupler KB357NT spec no: dsad2841 rev no: v.7 date: apr/06/2005 page: 5 of 7 approved: j. lu checked: tracy deng drawn: y.w.wang erp:120500 0034 cycle one cycle allowed to be dipped in solder including plastic nold portion. rosin flux containing small amount of chlorine (the flux with a maximum chlorine content of 0.2 wt % is recommended.) even if the voltage is within the absolute maximum ratings. be aware that power is suddenly into the component any surge current may cause damage happen, 2.cautions regarding noise avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. (2) cautions fluxes flux 260 or below (molten solder temperature) 1.recommended soldering conditions (dip soldering) less than 10 seconds. temperature (1) dip soldering time * notes on handling
photocoupler KB357NT spec no: dsad2841 rev no: v.7 date: apr/06/2005 page: 6 of 7 approved: j. lu checked: tracy deng drawn: y.w.wang erp:120500 0034 within this device there exists gaas (gallium arsenide) material which is a harmful substance if ingested. malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical specified operating ranges as set forth in the most recent products specifications. in developing your designs, please ensure that kingbright products are used within kingbright product could cause loss of human life, bodily injury or damage to property. stress. it is the responsibility of the buyer, when utilizing kingbright products, to observe standards of safety, and to a avoid situations in which a malfunction or failure of a document, please confirm that this is the latest version. not all devices / types available the information in this document is subject to change without notice. before using this restrictions on product use gaas dust and fumes are toxic. do not break, cut or pulverize the product, or use chemicals to dissolve them. we are mention about our product quality stablity, semiconductor devices in general can in every country. peak reflow temperature 235 c or below(package surface temperature) p a c k a g e s u r f a c e t e m p e r a t u r e t ( c ) 60 to 120s (preheating) 100 to 160 c caution to 30 s 210 c recommended temperature profile of infrared reflow flux rosin flux containing small amount of chlorine(the flux with a maximum chlorine content of 0.2wt % is recommended.) number or reflows three time of temperature higher than 210 c 30 seconds or less 235 c (peak temperature) (heating) to 10 s notes on handling (1).infrared reflow soldering 1.recommended soldering conditions
photocoupler KB357NT spec no: dsad2841 rev no: v.7 date: apr/06/2005 page: 7 of 7 approved: j. lu checked: tracy deng drawn: y.w.wang erp:120500 0034 outline and dimension ( (( ( tape ) )) ) (units : mm ) tape direction outline and dimension ( (( ( reel ) )) ) packing:1000pcs/reel
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